Direct Current Electrodeposition of Nickel-Tin Alloys from ILEG (ChCl:Ethylene glycol)

Fig. 1 SEM micrographs of Ni-Sn alloys electrodeposited in the DC regime at different current densities from different types of electrolytes: (a) ILEG-NiSn1 (0.33 M NiCl2 x6H2O+ 0.67 M SnCl2 x2H2O) , (b) ILEG-NiSn2 (0.5 M NiCl2 x6H2O+ 0.5 M SnCl2 x2H2O) , and (c) ILEG-NiSn3 (0.67 M NiCl2 x6H2O+ 0.33 M SnCl2 x2H2O)

Fig. 2 X-ray diffraction patterns of electrodeposited NiSn alloys on copper substrate: (a) linear scale and (b) logarithmic scale

Pulse Current Electrodeposition of Nickel-Tin Alloys from ILEG (ChCl:Ethylene glycol)

Fig. 3 Schematic diagram of plating wave

Table 1. Operating parametersfor the electrodeposition of Ni-Sn alloys from ILEG-NiSn2 system under direct current (sample DC) and pulse current (samples P1, P2, and P3).

Electrolysis Parameter NiSn-DC NiSn-P1 NiSn-P2 NiSn-P3
ON- and OFF- time durations of the pulse – TON = 5000 ms TOFF = 10,000 ms TON = 500 ms TOFF = 1000 ms TON = 50 ms TOFF = 100 ms
Frequency (Hz) – F = 0.067 Hz F = 0.67 Hz F = 6.7 Hz
Duty cycle – θ = 0.33 θ = 0.33 θ = 0.33
Current density (average density) I = 6.67 mA/cm2 iav = 6.67 mA/cm2 iav = 6.67 mA/cm2 iav = 6.67 mA/cm2

1 TON and TOFF are the ON and OFF time duration of the pulse.

Fig. 4 SEM micrographs recorded in cross-section on: (a) NiSn-DC, (b) NiSn-P1, (c) NiSn-P2, and (d) NiSn-P3 samples

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